Listed below is a selection of the equipment used in the cleanroom located in the main building at ITT.


Kurt J. Lesker PVD 75 & Edwards Auto 500 Thermal Evaporation & Sputtering Systems

These systems allow deposition of thin layer films on silicon substrates.  Conductive and dielectric targets can be sputtered while metal sources can be evaporated under high vacuum conditions.  Both machines are fitted with monitors allowing the control of deposition rates and overall layer thickness.  The Lesker system contains three evaporation sources besides the two sputtering magnetrons allowing the possibility of five separate layers without breaking the vacuum.

Sopralab GES-5E Spectroscopic Ellipsometer

Ellipsometry is an optical technique devoted to the analysis of surfaces based on the polarization of light after the reflection on a plane surface.  Analysis can be carried out on complex structures such as multilayers, interface roughness, inhomogeneous layers, among others.  Accurate layer thickness measurement down to nanometer level is possible.

Three Stack Furnace

Used for the growth of wet or dry oxides and the annealing of silicon wafers.  Each stack has individual MFC’s to flow nitrogen or oxygen and can heat to the region of 1300° C


Quintel Q-4000 Mask Aligner

System which allows accurate alignment of sensitized semiconductor wafers or substrates with a mask and exposes them to ultraviolet radiation to transfer the mask pattern for further processing on the way to producing a semiconductor or other microelectronic device.


Signatone Probe Station

This complete unit consists of four adjustable wafer probers set under a microscope on an anti-vibration table in a dark box.  The probing equipment is connected to a Agilent Parameter Analyser & Precision LCR Meter allowing highly accurate testing of microelectronic devices.